DSA00305735.pdf

Partial File Text Quality Evaluation Data for Lead-free SMD Peripheral Packages (Sn-Bi plating) August 30, 2002 Seiko Epson Corporation Contents 1. Observation of Surface Condition of Sn-Bi Type Lead Plati
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

DSA00305735.pdf preview

Download Datasheet

User Tagged Keywords

bi 240 epson, whisker NA-200 NA200 NA200 flux paste profile QFP 128 bonding QFP 208 QFP PACKAGE thermal resistance QFP-208 SMD Packages SnAgCu