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Scans-00142883.pdf
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MÃE D Ã1331Ã7 ODODHIS 3TH «SMl-B SEMELAB LTD DISTRIBUTED BASE TECHNOLOGY DIE DESIGNED AND DIFFUSED BY SEMEFAB G172 chip family The G172 chip family is an NPN bipolar multi-epitaxial plan
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ECAD Model
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User Tagged Keywords
3TH 40
BUL48A
BUL48B
BUL49A
BUL49B
G272A
G372A
G572A
G672A
G872A
G872DE
semefab
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