DSAIH00085526.pdf by Central Semiconductor

Partial File Text PROCESS CPD48V Schottky Diode High Current Schottky Diode Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 14 x 14 MILS Die Thickness 7.1 MILS Anode Bonding Pad Ar
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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