DSAIH00084679.pdf by Central Semiconductor

Partial File Text PROCESS CPD77X Schottky Rectiï¬er 3 Amp Schottky Rectiï¬er Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 61 x 61 MILS Die Thickness 5.9 MILS Anode Bonding Pad
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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