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    DSAIH00084678.pdf

    • Central Semiconductor
    • PROCESS CPD66X Low Leakage Diode Low Leakage Diode Chip PROCESS DETAILS Die Size 17.5 x 17.5 MILS Die Thickness 5.9 MILS Anode Bonding Pad Area 7.9 MILS DIAMETER Top Side
    • Original
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