Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSAIH00084678.pdf

    • Central Semiconductor
    • PROCESS CPD66X Low Leakage Diode Low Leakage Diode Chip PROCESS DETAILS Die Size 17.5 x 17.5 MILS Die Thickness 5.9 MILS Anode Bonding Pad Area 7.9 MILS DIAMETER Top Side
    • Original

    DSAIH00084678.pdf preview Download Datasheet

    Price & Stock Powered by Findchips

    Newly Added Datasheets | Privacy Policy | Digital Services Act | Contact Us | About Us

    Copyright © 2024.

    Supplyframe Tracking Pixel