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    DSA0028144.pdf

    • International Rectifier
    • AN-1011 Wafer Level Package Technology Board Mounting Application Note for 0.800mm pitch devices page Device construction 2 Design considerations 3 Assembly considerations 4
    • Original

    DSA0028144.pdf preview Download Datasheet

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    desoldering IRF6100 SN63 PB37 PROFILES wafer level package with or without underfill
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