DSA0027857.pdf by STMicroelectronics

Partial File Text AN1235 APPLICATION NOTE ® ASDTM and IPADTM FLIP-CHIP: PACKAGE DESCRIPTION AND RECOMMENDATIONS FOR USE I - INTRODUCTION The competitive market of portable equipment, notably the mobile p
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10E12 AN1235 IEC286-3 J-STD-020A Lead Free reflow soldering profile BGA pcb design 0,5 mm pitch 5x5 matrix PCB design for 0.2mm pitch csp package st micro trace date code STMicroelectronics marking code date BGA STMicroelectronics smd marking code Tape Resistivity 10E8 Ohm 10E4