DSASW00372054.pdf by Spansion

Partial File Text Chapter 2 Package Design CHAPTER 2 PACKAGE DESIGN Flammability Rating Oxygen Index Fine-Pitch Ball Grid Array Leadframe Packages Packages and Packing Methodologies Handbook 17 Oct 2008
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"moisture sensitivy level" C7025 CDA 194 D2863-77 footprint WSON jedec mo-142 dd jedec mo-142 footprint jedec ms-024 leadframe C7025 leadframe Cu C7025 MO-052 MO-108 MO-180 MS-013 MS-024 sac 305 spansion memory