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    DSA0027398.pdf

    • STMicroelectronics
    • AN577 APPLICATION NOTE PACKAGING AND SOLDERING METHOD DEVICES IN SMA, SMB AND SMC PACKAGE PACKING Devices in SMA, SMB and SMC package are delivered in standard embossed 12 & 16 mm tape and reel
    • Original
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    DSA0027398.pdf preview Download Datasheet

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    AN577 CECC00802 iec 286-3 stmicroelectronics

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