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DSA00299981.pdf
Manufacturer
Central Semiconductor
Partial File Text
PROCESS CPD91V Switching Diode Low Leakage Switching Diode Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 11 x 11 MILS Die Thickness 7.1 MILS Anode Bonding pad A
Datasheet Type
Original
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User Tagged Keywords
CMDD6001
CMLD6001
CMLD6001DO
CMOD6001
CMPD6001
CPD91V