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    DSA00299956.pdf by Central Semiconductor

    • PROCESS CP709 Power Transistor PNP - Low Saturation Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 41.3 x 41.3 MILS Die Thickness 9.0 MILS Base Bondin
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    CMPT7090L CMXT7090L CP709 CXT7090L CZT7090L
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