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    DSA00299951.pdf

    • Central Semiconductor
    • PROCESS CP611 Power Transistor PNP - Amp/Switch Transistor Chip PROCESS DETAILS Process EPITAXIAL BASE Die Size 80 X 99 MILS Die Thickness 12.5 ± 1 MILS Base Bonding Pad
    • Original
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    DSA00299951.pdf preview Download Datasheet

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