DSA3H002112.pdf

Manufacturer Xilinx
Partial File Text 100% Material Declaration Data Sheet FF1154 PK484 (v1.1) September 28, 2012 Average Weight: 13.5539g Component Silicon Die (FPGA) Solder Bump Tin (Sn) Lead (Pb) Die Underfill Bisphenol F-type liq
Datasheet Type Original
ECAD Model
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