DSA3H002102.pdf by Xilinx

Partial File Text 100% Material Declaration Data Sheet for FFG1759 Virtex®-6 PK427 (v1.2) October 19, 2012 Average Weight: 20.8072 g Component Silicon Die Doped silicon Solder Bump Tin Lead Die Underfill Bisphenol
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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