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    DSA00291708.pdf

    • Fischer Elektronik
    • Hola1 H A H Heatsinks for BGAs B C ­ particularly suited for Ball Grid Arrays ­ heatsink dimensions match the respective BGA-type ­ can be glued directly on the BGA component D
    • Original

    DSA00291708.pdf preview Download Datasheet

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    WLFT 404

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