DSA2IH00163078.pdf by Not Available

Partial File Text Hy Custom Hybrid ICs Hybrid IC component specifications-BX series Item Process Chip size Density BX- 1 2125 15 c h ip s /c nf Fro (general process) BX-II 1608 36 chips/'em * Front (high-density
Datasheet Type Scan
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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