DSA0019556.pdf by Motorola

Partial File Text Freescale Semiconductor, Inc. Application Note AN2388/D Rev. 0, 11/2002 Heatsink Small Outline Package (HSOP) Freescale Semiconductor, Inc... This application note covers the following to
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
Powered by Findchips

DSA0019556.pdf preview

Download Datasheet

User Tagged Keywords

36-Ld AN2388 BGA PACKAGE thermal resistance Freescale G38-87 HSOP 30 JEDEC JESD51-8 JEDEC JESD51-8 BGA JEDEC-STD-020 JESD-51 JESD-51-5 jesd51 8 JESD51-2 JESD51-3 JESD51-5 JESD51-7 JESD51-8 MO-166 outline of the heat slug for JEDEC QFN PACKAGE thermal resistance