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DSAFRAZ0023014.pdf
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CHIP SCALE PACKAGE ASSEMBLY GUIDE INTRODUCTION Dallas Semiconductor developed Chip Scale Package (CSP) to be assembled with processes typical of Surface Mount Technology (SMT). Applying some specia
Datasheet Type
Original
RoHS
Unknown
Pb Free
Unknown
Lifecycle
Unknown
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FR4 substrate
FR4 substrate epoxy
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PCB design for csp package
SN63A
underfill
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