DSAFRAZ0022825.pdf by Hewlett-Packard

Partial File Text MODAMP Silicon MMIC Chip Use Application Note S009 Introduction This Application Note supplies information needed to layout and assemble circuits when using Hewlett-Packard's MODAMP silicon MM
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1 kilo ohm resistor specifications AN-S003 bonding capillary GaAs MMIC ESD, Die Attach and Bonding Guidelines Gold wire bonding loops hp mmic MMIC 576 MSA-0100 MSA-0200 MSA-0300 MSA-0500 MSA-0600 MSA-0700 MSA-0900 MSA-1000 msa0100 msa1100

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