DSAZSAA00022016.pdf by TY Semiconductor

Partial File Text Product specification HSM88WA SOT-23 Unit: mm +0.1 2.9-0.1 +0.1 0.4-0.1 1 MPAK package is suitable for high density surface mounting and high speed assembly. 0.55 Proof agai
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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