DSASW00343897.pdf
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Samsung Electronics
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Jul. 2010
Packing Tray Material Line-up
Quantity
Bake Temp.
8.1*15.1(8*12),256M DDR 5G 60WMBG
Package
8*12
130 MAX
60M/54WBGA-8.10X15.10-8X12-A
TR_MARKING
LA69-00635A
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Original
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Part pricing, stock, data attributes from Findchips.com