DSAZSAA00020496.pdf by NXP Semiconductors

Partial File Text Reflow soldering footprint Footprint information for reflow soldering of TFBGA208 package SOT950-1 Hx P P Hy 0.475 see detail X solder land CL solder paste deposit SR CU
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock Find it at Findchips.com

DSAZSAA00020496.pdf preview Download Datasheet