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    DSAZSAA00020479.pdf

    • NXP Semiconductors
    • Reflow soldering footprint Footprint information for reflow soldering of HVQFN32 package SOT865-2 Hx Gx D P 0.025 0.025 C (0.105) SPx nSPx Hy SPy tot SPy Gy SL
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    DSAZSAA00020479.pdf preview Download Datasheet

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