DSAZSAA00020301.pdf by NXP Semiconductors

Partial File Text Reflow soldering footprint Footprint information for reflow soldering of HVSON12 package SOT1352-1 6.26 0.8 1.3 1.1 0.3 0.105 1 0.85 6.2 5.25 0.9 2.2 4.25 5.95 5.2
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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