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    DSAZSAA00020299.pdf

    • NXP Semiconductors
    • Reflow soldering footprint Footprint information for reflow soldering of XQFN10 package SOT1337-1 Hx Gx Fx P P 0.05 K 0.02 J D (10×) 0.05 0.02 C (6×) Hy Gy F
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