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    DSAZSAA00020296.pdf

    • NXP Semiconductors
    • Reflow soldering footprint Footprint information for reflow soldering of LFBGA267 package SOT1332-1 Hx ball A1 index area P P Hy see detail X solder land solder paste deposit
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    DSAZSAA00020296.pdf preview Download Datasheet

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