DSAZSAA00020290.pdf by NXP Semiconductors
- Reflow soldering footprint Footprint information for reflow soldering of CFP15 package SOT1289 4.6 3.63 1.4 (2x) 1.7 (2x) 1.5 (2x) 2.13 1.54 1.34 1.24 0.6 0.4 0.11 1.9 7.3
- Original
- Unknown
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