DSAZSAA00020282.pdf by NXP Semiconductors

Partial File Text Reflow soldering footprint Footprint information for reflow soldering of XQFN12 package SOT1174-1 2.25 2 0.45 0.22 CU (11Ã) 0.32 CU (1Ã) 0.45 (1Ã) 2.55 1 CU 2.05 2.3
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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