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    DSAZSAA00020276.pdf

    • NXP Semiconductors
    • Reflow soldering footprint Footprint information for reflow soldering of XQFN10 package SOT1160-1 1.95 1.7 CU 1.25 0.45 0.4 (6×) 0.22 CU (10×) 2.35 1 CU 0.85 2.1 CU 0.
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    DSAZSAA00020276.pdf preview Download Datasheet

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