DSAZSAA00020254.pdf by NXP Semiconductors

Partial File Text PC board footprint NXP Semiconductors Footprint information for reflow soldering of TFBGA64 package SOT1073-1 Hx P P Hy see detail X Generic footprint pattern Refer to the pa
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

DSAZSAA00020254.pdf preview Download Datasheet