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    DSAZSAA00020244.pdf

    • NXP Semiconductors
    • Reflow soldering footprint Footprint information for reflow soldering of XQFN10 package SOT1049-3 Hx Gx pa + oa 2.000 P 0.500 D (9x) 0.0125 0.0125 Hy Gy pa + oa By
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