DSAZSAA00020243.pdf by NXP Semiconductors

Partial File Text Reflow soldering footprint 3.250 2.300 pa + oa 2.000 0.500 0.500 0.250 0.0125 0.0125 2.850 1.900 pa + oa 0.800 2.600 1.100 3.000 solder lands solder paste www.nx
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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