DSAZSAA00020233.pdf by NXP Semiconductors
- Reflow soldering footprint Footprint information for reflow soldering of DFN1608D-2 package SOD1608 1.15 0.75 1.05 0.65 0.95 0.55 0.9 0.8 0.7 0.7 0.8 0.9 1 2 0.1
- Original
- Unknown
- Unknown
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