DSAZSAA00020100.pdf by NXP Semiconductors

Partial File Text Package outline WLCSP49: wafer level chip-size package; 49 bumps; 3.37 x 2.97 mm TFA9860/TFA9861 TFA9889/TFA9890 B D A ball A1 index area A E A2 A1 detail X e1 C b
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