DSAZSAA00020087.pdf
- NXP Semiconductors
- Package outline WLCSP100: wafer level chip-scale package; 100 balls; 5.074 x 5.074 x 0.6 mm B D LPC1768UK A ball A1 index area A2 A A1 E detail X e1 1/2 e e Ã
- Original
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