DSAZSAA00020061.pdf by NXP Semiconductors
- Package outline DFN1714-8: plastic, thermal enhanced extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1.7 x 0.5 mm SOT972-2 X A B D A E A1 c ter
- Original
- Unknown
- Unknown
- Unknown
-
Powered by
Findchips
