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DSAZSAA00020059.pdf
Manufacturer
NXP Semiconductors
Partial File Text
Package outline TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls; body 4 x 4 x 0.8 mm A B D SOT969-1 ball A1 index area E A A2 A1 detail X e1 1/2 e รข
Datasheet Type
Original
ECAD Model
Part Details
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