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    DSAZSAA00020056.pdf by NXP Semiconductors

    • Package outline LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls; body 12 x 12 x 1 mm B D SOT966-1 A ball A1 index area E A2 A A1 detail X
    • Original
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    DSAZSAA00020056.pdf preview

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