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DSAZSAA00020056.pdf
Manufacturer
NXP Semiconductors
Partial File Text
Package outline LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls; body 12 x 12 x 1 mm B D SOT966-1 A ball A1 index area E A2 A A1 detail X
Datasheet Type
Original
ECAD Model
Part Details
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