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DSAZSAA00020043.pdf
Manufacturer
NXP Semiconductors
Partial File Text
Package outline TFBGA208: plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.7 mm B D SOT950-1 A ball A1 index area E A A2 A1 detail X e1
Datasheet Type
Original
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