DSAZSAA00020035.pdf by NXP Semiconductors

Partial File Text Package outline HUQFN68U: plastic thermal enhanced ultra thin quad flat package; no leads; 68 terminals; UTLP based; body 8 Ã 8 Ã 0.55 mm B D SOT943-1 A terminal 1 index area A A1
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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