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DSAZSAA00020029.pdf
Manufacturer
NXP Semiconductors
Partial File Text
Package outline HLQFN56R: plastic thermal enhanced low profile quad flat package; no leads; 56 terminals; resin based; body 8 x 8 x 1.35 mm B D SOT935-2 A terminal 1 index area E
Datasheet Type
Original
ECAD Model
Part Details
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