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    DSAZSAA00020026.pdf by NXP Semiconductors

    • Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; 12 x 12 x 1 mm A B D SOT933-1 ball A1 index area E A2 A A1 detail X C
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    DSAZSAA00020026.pdf preview

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