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    DSAZSAA00020024.pdf

    • NXP Semiconductors
    • Package outline HLSON10R: plastic thermal enhanced low profile small outline package; no leads; 10 terminals; resin based; body 4 x 4 x 1.1 mm SOT931-1 X A B D E A A1 terminal
    • Original
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    DSAZSAA00020024.pdf preview Download Datasheet

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