DSAFRAZ00558.pdf by Xilinx

Partial File Text Xilinx Thermally Enhanced Packaging ® April 1996 Application Note The Package Offering Xilinx Code Body (mm) HQ304 HQ240 HQ208 THK (mm) Mass (gm) Heatsink Location JEDEC
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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eftec eftec 64 EFTEC-64 HQ208 HQ240 leadframe C7025 OPQ0014 OPQ0019 OPQ0020 XC4013E XC4020E

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