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DSAFRAZ004975.pdf
Manufacturer
Motorola
Partial File Text
MOTOROLA Order this EB211 document by EB211/D SEMICONDUCTOR ENGINEERING BULLETIN EB211 Thermal Management and Solder Mounting Method for the MRF286, 60 Watt Power Device in a CuW (Copper
Datasheet Type
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ECAD Model
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EB211
MRF286