DSA00334171.pdf by Intersil

Partial File Text PCB Land Pattern Design and Surface Mount Guidelines for MLFP Packages TM Technical Brief May 2001 TB389 Author: Jim Benson Introduction General Design Guidelines Intersil's Mic
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0.3mm pitch BGA fine BGA thermal profile Intersil cross reference ipc-SM-782 J-STD-005 JEDEC J-STD-005 MO-220 paste profile pitch 0.4mm BGA TB389 thermal pcb guidelines