DSA0055732.pdf by Central Semiconductor

Partial File Text Material Composition Specification SMDIP Case Pb (lead)-free plating** Device average mass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300 mg Fluctuation marg
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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