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Partial File Text DALLAS SEMICONDUCTOR DS2009 512x9 FIFO Chip FEATURES â¢ First-in, first-out memory-based architecture â¢ Flexible 512 x 9 organization â¢ Low-power HCMOS technology â¢ Asynchronous and simultaneou
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DS2009 DS2009-35 DS2009-50 DS2009-65 DS2009-80 DS2013